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參數資料
型號: W3H64M72E-533ESI
英文描述: 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
中文描述: 64米× 72 DDR2 SDRAM的208 PBGA封裝多芯片封裝
文件頁數: 7/30頁
文件大小: 956K
代理商: W3H64M72E-533ESI
W3H64M72E-XSBX
7
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
March 2006
Rev. 1
ADVANCED*
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
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FIGURE 4 – POWER-UP AND INITIALIZATION
Notes appear on page 9
相關PDF資料
PDF描述
W3H64M72E-533ESM 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H64M72E-533SB 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H64M72E-533SBC 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H64M72E-533SBI 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H64M72E-533SBM 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
相關代理商/技術參數
參數描述
W3H64M72E-533ESM 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H64M72E-533SB 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H64M72E-533SBC 制造商:Microsemi Corporation 功能描述:64M X 72 DDR2, 1.8V, 533MHZ, 208PBGA COMMERICAL TEMP. - Bulk
W3H64M72E-533SBI 制造商:Microsemi Corporation 功能描述:64M X 72 DDR2, 1.8V, 533MHZ, 208PBGA INDUSTRIAL TEMP. - Bulk 制造商:Microsemi Corporation 功能描述:SDRAM MEMORY
W3H64M72E-533SBM 制造商:Microsemi Corporation 功能描述:64M X 72 DDR2, 1.8V, 533MHZ, 208PBGA MIL-TEMP. - Bulk