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參數資料
| 型號： | W3H64M72E-667ES |
| 英文描述： | 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| 中文描述： | 64米× 72 DDR2 SDRAM的208 PBGA封裝多芯片封裝 |
| 文件頁數： | 29/30頁 |
| 文件大小： | 956K |
| 代理商： | W3H64M72E-667ES |
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W3H64M72E-XSBX
29
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
March 2006
Rev. 1
ADVANCED*
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
ORDERING INFORMATION
WHITE ELECTRONIC DESIGNS CORP.
DDR2 SDRAM
CONFIGURATION, 64M x 72
1.8V Power Supply
DATA RATE (Mbs)
400 = 400Mbs
533 = 533Mbs
667 = 667Mbs
Blank = No data rate specified for ES product
(1)
PACKAGE:
ES = Non Qualified Product
(1)
SB = 208 Plastic Ball Grid Array (PBGA)
DEVICE GRADE:
M = Military
I = In dus ri al
C = Com mer cial 0°C to +70°C
Blank = No temperature specified for ES product
(1)
-55°C to +125°C
-40°C to +85°C
W 3H 64M 72 E - XXX SB X
Note 1: W3H64M72E-ESSB is the only available product until completion of qualification.
相關PDF資料 |
PDF描述 |
|---|---|
| W3H64M72E-667ESC | 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H64M72E-667ESI | 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3HG128M64EEU665D4XXG | 1GB - 128Mx64 DDR2 SDRAM UNBUFFERED, SO-DIMM |
| W3HG128M64EEU806D4XXG | 1GB - 128Mx64 DDR2 SDRAM UNBUFFERED, SO-DIMM |
| W3HG128M64EEU-D4 | 1GB - 128Mx64 DDR2 SDRAM UNBUFFERED, SO-DIMM |
相關代理商/技術參數 |
參數描述 |
|---|---|
| W3H64M72E-667ESC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H64M72E-667ESI | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H64M72E-667ESM | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H64M72E-667SB | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H64M72E-667SBC | 制造商:Microsemi Corporation 功能描述:64M X 72 DDR2, 1.8V, 667MHZ, 208PBGA COMMERICAL TEMP. - Bulk |
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