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參數(shù)資料
| 型號(hào)： | WCMA2008U1B-FF70 |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | 256K x 8 Static RAM |
| 中文描述： | 256K × 8靜態(tài)RAM |
| 文件頁數(shù)： | 3/11頁 |
| 文件大小： | 144K |
| 代理商： | WCMA2008U1B-FF70 |
WCMA2008U1B
3
Electrical Characteristics
Over the Operating Range
Test Conditions
WCMA2008U1B-70
Param-
eter
V
OH
V
OL
V
IH
V
IL
I
IX
I
OZ
I
CC
Description
Output HIGH Voltage
Output LOW Voltage
Input HIGH Voltage
Input LOW Voltage
Input Leakage Current
Output Leakage Current GND < V
O
< V
CC
, Output Disabled
V
Operating Supply
Current
f = 1 MHz
Min.
2.4
Typ.
[2]
Max.
Unit
I
OH
= –1.0 mA
I
OL
= 2.1 mA
V
CC
= 2.7V
V
CC
= 2.7V
V
0.4
V
2.2
–0.3
–1
–1
V
CC
+ 0.3V
0.8
+1
+1
V
V
μ
A
μ
A
mA
GND < V
I
< V
CC
f =f
MAX
= 1/t
RC
V
CC
= 3.3V
I
= 0 mA
CMOS Levels
7
15
1.5
3
I
SB1
Automatic CE
Power-Down Current —
CMOS Inputs
CE
1
> V
CC
– 0.2V or CE
2
< 0.2V
V
> V
– 0.2V or V
< 0.2V,
f = f
max
(Address and Data Only),
f = 0 (OE,WE)
2
10
μ
A
I
SB2
Automatic CE
Power-Down Current—
CMOS Inputs
CE
> V
CC
– 0.2V or CE
< 0.2V
V
> V
CC
0.2V or V
IN
< 0.2V,
f = 0, V
CC
=3.3V
Capacitance
[3]
Parameter
Description
Test Conditions
T
A
= 25°C, f = 1 MHz,V
CC
= Vcc
(typ)
Max.
6
8
Unit
pF
pF
C
IN
C
OUT
Input Capacitance
Output Capacitance
Thermal Resistance
Description
Test Conditions
Symbol
Θ
JA
BGA
55
Unit
°
C/W
Thermal Resistance
[3]
(Junction to Ambient)
Thermal Resistance
[3]
(Junction to Case)
Still Air, soldered on a 4.25 x 1.125 inch, 4-layer print-
ed circuit board
Θ
JC
16
°
C/W
Note:
3.
Tested initially and after any design or process changes that may affect these parameters.
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