- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄363886 > W3EG7266S-D3 512MB - 64Mx72 DDR SDRAM REGISTERED w/PLL PDF資料下載
參數(shù)資料
| 型號(hào)： | W3EG7266S-D3 |
| 英文描述： | 512MB - 64Mx72 DDR SDRAM REGISTERED w/PLL |
| 中文描述： | 512MB的- 64Mx72 DDR SDRAM的注冊(cè)瓦特/鎖相環(huán) |
| 文件頁(yè)數(shù)： | 12/12頁(yè) |
| 文件大?。?/td> | 184K |
| 代理商： | W3EG7266S-D3 |
12
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
W3EG7266S-D3
PRELIMINARY
October 2005
Rev. 3
Document Title
512MB – 64Mx72 DDR SDRAM REGISTERED w/PLL
Revision History
Rev #
History
Release Date
Status
Rev A
Created
2-21-02
Advanced
Rev B
Corrected mechanical drawing
5-23-02
Advanced
Rev 1
1.1 Updated CAP and I
DD
specs
1.2 Removed "ED" from part number
1.3 Moved from Advanced to Preliminary
6-04
Preliminary
Rev 2
2.1 Added "JD3" package option
2.2 Updated I
DD
specs
2.3 "D3" NOT RECOMMENDED FOR NEW DESIGNS
3.1 Removed "JD3" laminate, does not support
3.2 Use "D3" package option
11-04
Preliminary
Rev 3
10-05
Preliminary
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| W3H32M72E-400ES | 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M72E-400ESC | 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M72E-400ESI | 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M72E-400ESM | 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M72E-SB | 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W3F | 制造商:AVX 制造商全稱:AVX Corporation 功能描述:Feedthru 0805/1206 Capacitors |
| W3F11A 471 8AT1F | 制造商:KYOCERA ELCO Corporation 功能描述:Cap Ceramic 470pF 100V C0G -20% to 50% SMD 1206 125 制造商:AVX 功能描述:Cap Ceramic 470pF 100V C0G -20% to 50% SMD 1206 125 |
| W3F11A1018AT | 制造商:AVX 制造商全稱:AVX Corporation 功能描述:Feedthru 0805/1206 Capacitors |
| W3F11A1018AT1A | 功能描述:饋通電容器 100volts 100pF NP0 1206 RoHS:否 制造商:Tusonix 電容:8200 pF 容差:- 20 %, + 80 % 電壓額定值: 工作溫度范圍: 溫度系數(shù): 封裝 / 箱體: |
| W3F11A1018AT1A | 制造商:AVX Corporation 功能描述:CAPACITOR 100PF |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。