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參數(shù)資料
| 型號(hào)： | W55MID50 |
| 廠商： | WINBOND ELECTRONICS CORP |
| 英文描述： | WINBOND MFID READER |
| 中文描述： | 華邦MFID讀者 |
| 文件頁(yè)數(shù)： | 7/10頁(yè) |
| 文件大小： | 293K |
| 代理商： | W55MID50 |
W55MID50 Data Sheet
Winbond Electronics Corp. 7 Revision: A3 Publish Date: 2003/3/24
Electronic Characteristics
3.1 W55MID50 Absolute Maximum Ratings
Parameter
Rating
10
100
0 to +70
-40 to +85
Unit
mA
mW
°
C
°
C
Maximum Current in COIL
Power Dissipation (T
a
= 70
°
C)
Ambient Operating Temperature
Storage Temperature
Note:
Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device.
3.2 W55MID50 DC Characteristics
(VDD-VSS = 4.5 V, Ta = 25
°
C; unless otherwise specified)
Parameter
Operating Magnetic Field
Operating Voltage
Operating Temperature
Operating Current
Stand-by Current
Sink Current
Source Current
Sym.
f
OP
V
DD
Tamb
I
OP
I
SB
I
SK
I
SR
Conditions
Min.
-
3
0
-
-
-
-
Typ.
13.56
-
25
22
0.7
10
-6
Max.
-
5.5
70
-
1
-
-
Unit
MHz
V
°
C
mA
uA
mA
mA
Field in resonation
Field in resonation
Ambient operating temp
f
OP
= 13.56MHz
Power Down mode enter
VoL = 0.3VDD
VoH = 0.7VDD
3.3 W55MID50 Ordering Information
W55MID50 provides two types of package in shipment: Dice form, PDIP-20, SOP-20, and Wafer
Part Number
Package
W55MID50
Dice form
W55MID50
PDIP-20
W55MID50
SOP-20
W55MID50
Wafer form
Remarks
MOQ required
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