| 型號: | W3H64M72E-400SBC |
| 英文描述: | 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| 中文描述: | 64米× 72 DDR2 SDRAM的208 PBGA封裝多芯片封裝 |
| 文件頁數: | 2/30頁 |
| 文件大小: | 956K |
| 代理商: | W3H64M72E-400SBC |

相關PDF資料 |
PDF描述 |
|---|---|
| W3H64M72E-400SBI | 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H64M72E-400SBM | 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H64M72E-533ES | 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H64M72E-533ESC | 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H64M72E-533ESI | 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
相關代理商/技術參數 |
參數描述 |
|---|---|
| W3H64M72E-400SBI | 制造商:Microsemi Corporation 功能描述:64M X 72 DDR2, 1.8V, 400MHZ, 208PBGA IND TEMP CUSTOM - Bulk 制造商:Microsemi Corporation 功能描述:SDRAM MEMORY |
| W3H64M72E-400SBM | 制造商:Microsemi Corporation 功能描述:64M X 72 DDR2, 1.8V, 400MHZ, 208PBGA MIL-TEMP. - Bulk 制造商:Microsemi Corporation 功能描述:SDRAM MEMORY |
| W3H64M72E-533ES | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H64M72E-533ESC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H64M72E-533ESI | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |