
P01 Series
5/6
Fig. 10:
On-state characteristics (maximum
values).
Fig. 11:
SOT-223 Thermal resistance junction to
ambient versus copper surface under tab (Epoxy
printed circuit board FR4, copper thickness:
35
μ
m).
ITM(A)
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
1E+1
1E+0
1E-1
1E-2
VTM(V)
Rth(j-a) (°C/W)
S (cm )
2
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
130
120
110
100
90
80
70
60
50
40
30
20
10
0
PACKAGE MECHANICAL DATA
TO-92 (Plastic)
D
F
a
E
B
A
C
REF.
DIMENSIONS
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
B
C
D
E
F
a
1.35
0.053
4.70
0.185
2.54
0.100
4.40
12.70
0.173
0.500
3.70
0.50
0.146
0.019