
AD8017
–15–
REV. A
LAYOUT CONSIDERATIONS
The specified high speed performance of the AD8017 requires
careful attention to board layout and component selection.
Table II shows recommended component values for the AD8017
and Figures 42
–
44 show recommended layouts for the 8-lead
SOIC package for a positive gain. Proper RF design techniques
and low parasitic component selections are mandatory.
Table II. Typical Bandwidth vs. Gain Setting Resistors
(V
S
= 6 V, R
L
= 100 )
Small Signal
–3 dB BW (MHz)
Gain
R
F
( )
619
619
619
619
R
G
( )
619
R
T
( )
54.5
49.9
49.9
49.9
–
1
+1
+2
+10
110
320
160
40
619
68.8
R
T
chosen for 50
characteristic input impedance.
The PCB should have a ground plane covering all unused
portions of the component side of the board to provide a low
impedance ground path. The ground plane should be removed
from the area near the input pins to reduce stray capacitance.
Chip capacitors should be used for supply bypassing (see Fig-
ures 4 and 7). One end should be connected to the ground
plane and the other within 1/8 in. of each power pin. An addi-
tional (4.7
μ
F
–
10
μ
F) tantalum electrolytic capacitor should be
connected in parallel.
The feedback resistor should be located close to the inverting
input pin in order to keep the stray capacitance at this node to
a minimum. Capacitance greater than 1.5 pF at the inverting
input will significantly affect high speed performance when
operating at low noninverting gain.
Figure 42. Universal SOIC Noninverter Top Silkscreen
Figure 43. Universal SOIC Noninverter Top
Figure 44. Universal SOIC Noninverter Bottom