
Phycomp
Product specification
Surface-mount ceramic
EMI filter
X2Y Series
2002 Jul 10 Rev.6
15
www.yageo.com
TEST AND REQUIREMENTS
IEC
60 384-10/
CECC 32 100
CLAUSE
IEC
60 068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
4.4
Mounting
The capacitor may be
mounted on printed-circuit
boards or ceramic substrates
by applying reflow soldering
(including vapour phase
soldering) or conductive
adhesive
No visible damage
4.5
Visual inspection and
dimension check
Any applicable method using
x 10 magnification
In accordance with
specification
4.6.1
Capacitance
Class 1:
1000 pF; f = 1MHz
> 1000 pF; f = 1kHz
NP0: measuring voltage 1V
at 20
oC
Class 2:
For all capacitors f = 1 kHz
X7R: measuring voltage 1V
at 20
oC
Y5V: measuring voltage 1V
at 25
oC
Within specified tolerance
4.6.2
Tan
d
Class 1:
1000 pF; f = 1MHz
> 1000 pF; f = 1kHz
NP0: measuring voltage 1V
at 20
oC
Class 2:
For all capacitors f = 1 kHz
X7R: measuring voltage 1V
at 20
oC
Y5V: measuring voltage 1V
at 25
oC
In accordance with
specification
4.6.3
Insulation resistance
At U
R (DC) for 1 minute
In accordance with
specification
4.6.4
Voltage proof
2.5 x U
R for 1 minute
No breakdown or
flashover
4.7.1
Temperature
characteristic
Between minimum and
maximum temperature
In accordance with
specification
4.8
Adhesion
A force of 5 N applied for
10 s to the line joining the
terminations and in a plane
parallel to the substrate
No visible damage
Mounting in accordance with
CECC 32 100, paragraph 4.4
No visible damage
4.9
Bond strength of
plating on end face
Conditions: bending 1 mm at
a rate of 1 mm/s, radius jig
340 mm
DC/C:
class 1: within
10%
class 2, X7R: within
10%
class 2, Y5V: within
30%